Cooler Master HTK-002-U1 High Performance Thermal Compound Paste
Product Info
Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.
Features
- Suitable for CPU, chipsets on mainboard, VGA card, etc.
- Easy to use
- Zif Socket Templates ensure correct applying area with various CPU socket types
- Produces an even layer when using applicator
- Dielectric
- Wide range of application temperature
Specifications
| Part Number | HTK-002-U1 |
|---|---|
| Colour | White |
| Specific Gravity | 2.37 |
| Viscosity / Flowability | Non-flowing |
| Thermal Conductivity | 0.8 watts/meter-°C |
| Volume Resistivity | 5.0 x 1015 |
| Dielectric Constant | 4.4 at 100kHz |
| Dissipation Factor | 0.02 at 100kHz |
| Dielectric Strength | 550 volts/mil (21.7 kV/mm) |
| Dimensions | N/A |
| Weight | N/A |
Package Contents
- Cooler Master High Performance Thermal Paste
- User's Information
